Chia Nan University of Pharmacy & Science Institutional Repository:Item 310902800/32151
English  |  正體中文  |  简体中文  |  全文筆數/總筆數 : 18074/20272 (89%)
造訪人次 : 4082804      線上人數 : 1140
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
搜尋範圍 查詢小技巧:
  • 您可在西文檢索詞彙前後加上"雙引號",以獲取較精準的檢索結果
  • 若欲以作者姓名搜尋,建議至進階搜尋限定作者欄位,可獲得較完整資料
  • 進階搜尋
    請使用永久網址來引用或連結此文件: https://ir.cnu.edu.tw/handle/310902800/32151


    標題: Adsorption Behavior of TBPS in the Process of Cu Electrodeposition on an Au Film
    作者: Chen, Liang-Huei
    Liu, Yung-Fang
    Krug, Klaus
    Lee, Yuh-Lang
    貢獻者: Chia Nan Univ Pharm & Sci, Dept Med Chem
    Natl Cheng Kung Univ Tainan, Dept Chem Engn
    關鍵字: Surface Enhanced Infrared Adsorption Spectroscopy
    cyclic voltammetry
    electroplating additive
    adsorption
    日期: 2018-06
    上傳時間: 2019-11-15 15:42:53 (UTC+8)
    出版者: JAPAN OIL CHEMISTS SOC
    摘要: The adsorption behavior of an Cu electroplating additive, 3,3 thiobis-(1-propanesulfonic acid sodium salt) (TBPS) in a process of Cu deposition onto a single crystalline Au(111) surface is studied by an in-situ Surface-Enhanced Infrared Absorption Spectroscopy (SEIRAS). The SEIRAS spectra of the TBPS adlayer on a Cu film is investigated first and compared to that on an Au film. These results are utilized to evaluate the characteristics of TBPS adlayer on the electrode surface during the Cu deposition and stripping processes. The results show that the SEIRAS spectra of TBPS adsorbed on the Cu film resembles closely to that on the Au film, and the most pronounced peaks are symmetric S-O (ss-SO) and asymmetric S-O (as-SO) stretching modes. However, the as-SO band is sharper with a higher intensity on the Cu film. Since the ss-SO and as-SO peaks correspond to the molecular with upright and lie-down orientations, respectively, it implies that the TBPS molecules have higher ratio of lie-down orientation on the Cu film. In the Cu electrodeposition process, the cyclic voltammetry (CV) result shows that the presence of the TBPS in the HClO4 solution can decrease the inhibition effect of HClO4 to the Cu deposition. For the spectra measured at various potential during cathodic and anodic sweeping, an obvious change of the spectra occurs at ca. 0.6 V, the initiation of Cu underpotential deposition (Cu-UPD). For potentials higher and lower than 0.6 V, the spectra are similar, respectively, to those measured for the Au and Cu films. This result indicates that the TBPS molecules originally adsorbing on the Au film transfer to the surface of deposited Cu layer. This inference is also confirmed by the variation in wavenumber and peak intensity of ss-SO and as-SO peaks during the potential sweeping.
    link: http://dx.doi.org/10.5650/jos.ess18016
    關聯: Toxicology and Applied Pharmacology, v.67, n.6, pp.719-725
    顯示於類別:[食藥產業暨檢測科技系(含五專)] 期刊論文

    文件中的檔案:

    檔案 描述 大小格式瀏覽次數
    10.5650-jos.ess18016.pdf481KbAdobe PDF487檢視/開啟
    index.html0KbHTML1399檢視/開啟


    在CNU IR中所有的資料項目都受到原著作權保護.

    TAIR相關文章

    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - 回饋