Adsorption Behavior of TBPS in the Process of Cu Electrodeposition on an Au Film

doi:10.5650/jos.ess18016

Chia Nan University of Pharmacy & Science Institutional Repository > 藥理學院 > 食藥產業暨檢測科技系(含五專) > 期刊論文 > Item 310902800/32151

請使用永久網址來引用或連結此文件: https://ir.cnu.edu.tw/handle/310902800/32151

標題:	Adsorption Behavior of TBPS in the Process of Cu Electrodeposition on an Au Film
作者:	Chen, Liang-Huei Liu, Yung-Fang Krug, Klaus Lee, Yuh-Lang
貢獻者:	Chia Nan Univ Pharm & Sci, Dept Med Chem Natl Cheng Kung Univ Tainan, Dept Chem Engn
關鍵字:	Surface Enhanced Infrared Adsorption Spectroscopy cyclic voltammetry electroplating additive adsorption
日期:	2018-06
上傳時間:	2019-11-15 15:42:53 (UTC+8)
出版者:	JAPAN OIL CHEMISTS SOC
摘要:	The adsorption behavior of an Cu electroplating additive, 3,3 thiobis-(1-propanesulfonic acid sodium salt) (TBPS) in a process of Cu deposition onto a single crystalline Au(111) surface is studied by an in-situ Surface-Enhanced Infrared Absorption Spectroscopy (SEIRAS). The SEIRAS spectra of the TBPS adlayer on a Cu film is investigated first and compared to that on an Au film. These results are utilized to evaluate the characteristics of TBPS adlayer on the electrode surface during the Cu deposition and stripping processes. The results show that the SEIRAS spectra of TBPS adsorbed on the Cu film resembles closely to that on the Au film, and the most pronounced peaks are symmetric S-O (ss-SO) and asymmetric S-O (as-SO) stretching modes. However, the as-SO band is sharper with a higher intensity on the Cu film. Since the ss-SO and as-SO peaks correspond to the molecular with upright and lie-down orientations, respectively, it implies that the TBPS molecules have higher ratio of lie-down orientation on the Cu film. In the Cu electrodeposition process, the cyclic voltammetry (CV) result shows that the presence of the TBPS in the HClO4 solution can decrease the inhibition effect of HClO4 to the Cu deposition. For the spectra measured at various potential during cathodic and anodic sweeping, an obvious change of the spectra occurs at ca. 0.6 V, the initiation of Cu underpotential deposition (Cu-UPD). For potentials higher and lower than 0.6 V, the spectra are similar, respectively, to those measured for the Au and Cu films. This result indicates that the TBPS molecules originally adsorbing on the Au film transfer to the surface of deposited Cu layer. This inference is also confirmed by the variation in wavenumber and peak intensity of ss-SO and as-SO peaks during the potential sweeping.
link:	http://dx.doi.org/10.5650/jos.ess18016
關聯:	Toxicology and Applied Pharmacology, v.67, n.6, pp.719-725
顯示於類別:	[食藥產業暨檢測科技系(含五專)] 期刊論文

文件中的檔案:

檔案	描述	大小	格式	瀏覽次數
10.5650-jos.ess18016.pdf		481Kb	Adobe PDF	492	檢視/開啟
index.html		0Kb	HTML	1426	檢視/開啟

在CNU IR中所有的資料項目都受到原著作權保護.

TAIR相關文章

資料載入中.....