含亞醯胺基及磷基團環氧樹脂的合成及其熱裂解機構研究

Chia Nan University of Pharmacy & Science Institutional Repository > 藥理學院 > 食藥產業暨檢測科技系(含五專) > 科技部計畫 > Item 310902800/1897

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標題:	含亞醯胺基及磷基團環氧樹脂的合成及其熱裂解機構研究 Syntheses of Epoxy Resin Modified by Imide/Phosphorus Groups and Research of the Mechanism on Pyrolysis
作者:	蕭明達 Min-Da Shau
貢獻者:	醫藥化學系
關鍵字:	環氧樹脂醯亞胺基裂解機構磷基阻燃性 Epoxy resin Imide group Pyrolysis mechanism Phosphorus group Flame resistance
日期:	1999
上傳時間:	2008-07-18 16:23:24 (UTC+8)
出版者:	台南縣：嘉南藥理科技大學醫藥化學系
摘要:	合成含亞醯胺基及硫基團的環氧樹脂(DIDE),此新環氧樹脂以EA,IR 1H-NMR,13C-NMR確定其結構,並比較九種硬化物;DIDE/BAMP,Epon 828/BAMP,DEN438/BAMP,DIDE/DDS,Epon 828/DDS,DEN 438/DDS, DIDE/DDM,Epon 828/DDM,DEN 438/DDM的反應性及耐熱耐燃性。其反應性乃以DSC來評估,而耐熱耐燃性,乃以TGA評估,並以FT-IR探討DIDE/DDS之熱裂解行為。根據結果顯示;引入亞醯胺基確實可改善環氧樹脂之耐熱性。 A new type of epoxy resin which contained imide group and sulfone in the main chain was synthesized. The structure of the new type of epoxy resin was confirmed by elemental analysis (EA), infrared spectroscopy (IR), and 1H-NMR and 13C-NMR spectroscopies. In addition, compositions of the new synthesized imide epoxy resin (DIDE) with three curing agents. e.g., bis(3-aminophenyl) -methylphosphine oxide (BAMP), 4-4'-diaminodiphenylmethane (DDM), 4-4'-diaminodiphenylsulfone (DDS), were used for making a comparison of its curing reactivity, heat, and flame retardancy with that of Epon 828 and DEN 438. The reactivity were measured by differential scanning calorimetry (DSC). Through the evaluation of thermal gravimetric analysis (TGA), those polymers which were obtained through the curing reactions between the new epoxy resin and three curing agents (BAMP, DDS, DDM) also demonstrated excellent thermal properties. In order to study the thermal degradation of the imide polymer structure at characterized temperature. The cured polymer DIDE/DDS were heated at designed temperature with time interval from 5 min to 60 min and the chemical change was evaluated by Fourier transform infrared (FT-IR).
關聯:	計畫編號:NSC88-2216-E041-002
顯示於類別:	[食藥產業暨檢測科技系(含五專)] 科技部計畫

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