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    Please use this identifier to cite or link to this item: http://ir.cnu.edu.tw/handle/310902800/32205


    標題: Enhanced reliability of LEDs encapsulated with surface-modified zirconia/silicone hybrids under thermal shock
    作者: Lin, Yen-Ting
    Li, Yen-Hsien
    Lei, I-Ann
    Kuo, Chih-Yu
    Lee, Chia-Fen
    Chiu, Wen Yen
    Don, Trong-Ming
    貢獻者: Natl Taiwan Univ, Dept Chem Engn
    Natl Taiwan Univ, Dept Mat Sci & Engn
    Natl Taiwan Univ, Inst Polymer Sci & Engn
    Chia Nan Univ Pharm & Sci, Dept Cosmet Sci
    Chia Nan Univ Pharm & Sci, Inst Cosmet Sci
    Tamkang Univ, Dept Chem & Mat Engn
    關鍵字: LED
    Silicone
    Zirconia
    Encapsulation
    Thermal shock
    日期: 2018-02-15
    上傳時間: 2019-11-15 15:45:07 (UTC+8)
    出版者: ELSEVIER SCIENCE SA
    摘要: This study focused on the importance of the interfacial adhesion in the zirconia (ZrO2)/silicone hybrids as the encapsulating material on the reliability of the LEDs. Surface-modified ZrO2 nanoparticles (m-ZrO2) with functional groups were prepared by a sol-gel reaction which could become reactive to the silicone resin. The produced m-ZrO2/silicone hybrid at 5 wt% had a refractive index of 1.569 at 633 nm and light transmittance of 98.9%. Moreover, the coefficient of thermal expansion was greatly reduced by the introduction of m-ZrO2 into the silicone resin. When using this m-ZrO2/silicone hybrid, the luminous flux of the LED was 10.1% higher than that using a neat silicone resin. Most importantly, the LEDs encapsulated with the m-ZrO2/silicone had the best performance under thermal shock among all the LEDs tested in this study, owing to its strong interfacial adhesion between the nanoparticles and matrix. Moreover, the thermal stresses developed in hybrids were calculated and found to agree with the performance evaluation of the encapsulated LEDs under thermal shock, in which the m-ZrO2/silicone hybrid had the lowest thermal stress. This study proposed that the m-ZrO2/silicone hybrid material with strong interfacial adhesion could be useful for the encapsulation of LEDs even under extreme thermal conditions. (C) 2017 Elsevier B.V. All rights reserved.
    link: http://dx.doi.org/10.1016/j.matchemphys.2017.12.011
    關聯: Kaohsiung Journal of Medical Sciences, v.206, pp.136-143
    Appears in Collections:[化妝品應用與管理系(所)] 期刊論文

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